Paste designed for soldering SMD components in production processes that do not include washing phase. It is based on a 'no clean' flux type, that does not require cleaning and its residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and wettability of soldered surface. It does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature.
| Manufacturer | AG TERMOPASTY |
| Type of solder | for soft soldering |
| Appearance | paste |
| Alloy composition | Sn96,5Ag3Cu0,5 |
| Kind of solder | lead free |
| Kind of package | syringe |
| Grain size | 25...45µm |
| Weight | 8g |
| Melting point | 217°C |
| Flux content | 15% |
| Kind of flux | No Clean |
| Caution! | store in temperature about 8 °C |
| Capacity | 1.4ml |
| Signal word | Warning |
| Hazard statements | H317: May cause an allergic skin reaction. |
Agent features:
- lead free
- residues can be cleaned with alcohol-based agents
- residues need no cleaning
- P261: Avoid breathing dust/fume/gas/mist/vapours/spray.
- P280: Wear protective gloves/protective clothing/eye protection/face protection.
- P501: Dispose of contents/container to
- P333 + P313: If skin irritation or rash occurs: Get medical advice/attention.
- P362: Take off contaminated clothing and wash before reuse.
- Gross weight: 23.1 g
- Manufacturer part number: ART.AGT-028
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